Grain size effect on strain localization, slip-grain boundary interaction and damage in the Alloy 718 Ni-based superalloy at 650 °C - IMT Mines Albi-Carmaux Accéder directement au contenu
Article Dans Une Revue Materials Science and Engineering: A Année : 2024

Grain size effect on strain localization, slip-grain boundary interaction and damage in the Alloy 718 Ni-based superalloy at 650 °C

Résumé

Grain size effects on the early plastic strain localization and slip transfer at grain boundaries were investigated for the Alloy 718 Ni-based superalloy at 650 °C. Three microstructures with different grain sizes underwent monotonic tensile tests at 650 °C, both in air and under vacuum, until rupture. All the microstructure variants exhibit fully intragranular fracture under vacuum and partially intergranular fracture in air. In this latter case, predominant intergranular fracture mode was found in the fine-grain microstructures. Interrupted tensile tests were also conducted under vacuum with ex-situ SEM high-resolution digital image correlation (HR-DIC) measurements to assess in-plane kinematics fields at the microstructure scale. Out-of-plane displacement jumps were obtained using laser scanning confocal microscopy. Both crystallographic slip within grains and near twin boundaries (TBs) and morphological sliding happening at grain boundaries (GBs) were documented. Statistical analysis of all plastic events aimed at quantifying strain localization distribution as a function of the microstructure. The fine-grain microstructure was found to have extensive strain localization at grain boundaries, while the coarse-grain microstructure is more prone to intragranular slip development and slip localization near TBs. Different scenarios of slip band/grain boundary interactions were evidenced.
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hal-04664076 , version 1 (18-08-2024)

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Malo Jullien, R.L. Black, Jean Charles Stinville, Marc Legros, Damien Texier. Grain size effect on strain localization, slip-grain boundary interaction and damage in the Alloy 718 Ni-based superalloy at 650 °C. Materials Science and Engineering: A, 2024, 912, pp.146927. ⟨10.1016/j.msea.2024.146927⟩. ⟨hal-04664076⟩
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